Please use this identifier to cite or link to this item: https://open.uns.ac.rs/handle/123456789/9544
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dc.contributor.authorRadosavljević, Goranen_US
dc.contributor.authorMarić, Andreaen_US
dc.contributor.authorSmetana W.en_US
dc.contributor.authorŽivanov, Ljiljanaen_US
dc.date.accessioned2019-09-30T09:16:39Z-
dc.date.available2019-09-30T09:16:39Z-
dc.date.issued2011-12-01-
dc.identifier.isbn0930815920en_US
dc.identifier.urihttps://open.uns.ac.rs/handle/123456789/9544-
dc.description.abstractThis paper presents for the first time a parallel comparison of the performance of RF inductors realized on different substrate configurations. Presented inductors are meander type structures fabricated in Low Temperature Co-fired Ceramic (LTCC) technology. Also, chosen material is never before implemented for inductor fabrication. The performance improvement is achieved by design optimization of different substrate configurations that incorporate placement of an air-gap beneath the inductor and/or introduction of an additional shielding layer on the top. Designed structures are characterized on the basis of simulation and experimental data, achieving good correlation between obtained results. Presented results show over 30 % increase in quality factor and widening of the operating frequency range by over 55 %. © Copyright Honeywell Federal Manufacturing & Technologies LLC, 2011.en
dc.relation.ispartofProceedings - 2011 IMAPS/ACerS 7th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2011en
dc.titlePerformance improvement of RF inductors using LTCC technologyen_US
dc.typeConference Paperen_US
dc.identifier.scopus2-s2.0-84877769738-
dc.identifier.urlhttps://api.elsevier.com/content/abstract/scopus_id/84877769738-
dc.description.versionUnknownen_US
dc.relation.lastpage58en
dc.relation.firstpage54en
item.grantfulltextnone-
item.fulltextNo Fulltext-
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