Please use this identifier to cite or link to this item:
https://open.uns.ac.rs/handle/123456789/11633
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Unger M. | en |
dc.contributor.author | Radosavljević G. | en |
dc.contributor.author | Smetana W. | en |
dc.contributor.author | Živanov L. | en |
dc.contributor.author | Koeh T. | en |
dc.date.accessioned | 2020-03-03T14:45:10Z | - |
dc.date.available | 2020-03-03T14:45:10Z | - |
dc.date.issued | 2009-11-20 | en |
dc.identifier.isbn | 9781424442607 | en |
dc.identifier.uri | https://open.uns.ac.rs/handle/123456789/11633 | - |
dc.description.abstract | The material properties (TCE, dielectric number, etc.) ofdifferent LTCC (L.ow [empercuure f;.o-fired f;.eramics) - tape materials were characterized separately and compared to the behavior of combinations ofthese tapes that were laminated and co-fired. The effects ofdifferent values ofthermal expansion and change in dielectric number ofthe combined material stacks have been investigated by finite element analyses and verified using a wireless readout resonant temperature sensor as a demonstration device. | en |
dc.relation.ispartof | ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings | en |
dc.title | Parameters governing the sensor characteristic of capacitive temperature sensors built up in LTCC-technology | en |
dc.type | Conference Paper | en |
dc.identifier.doi | 10.1109/ISSE.2009.5207056 | en |
dc.identifier.scopus | 2-s2.0-70449553394 | en |
dc.identifier.url | https://api.elsevier.com/content/abstract/scopus_id/70449553394 | en |
item.fulltext | No Fulltext | - |
item.grantfulltext | none | - |
Appears in Collections: | FTN Publikacije/Publications |
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