Thermal behavior of Al-, AlFe- And AlCu-pillared interlayered clays

Abstract

The purified bentonite parent clay, fraction ≤ 2 μm of montmorillonite type, has been pillared by various polyhydroxy cations, Al, AlFe and AlCu, using conventional pillaring methods. The thermal behavior of PILCs was investigated by combination of X-ray diffraction (XRD), thermal analysis (DTA, TG) and low temperature N2 adsorption/desorption (LTNA). Thermal stability of Al-, AlFe- and AlCu-PILC samples was estimated after isothermal pretreatment in static air on the temperatures 300, 500, 600 and 900°C. Crucial structural changes were not registered, up to 600°C, but the fine changes in interlayer surrounding and porous/microporous structure being obvious at lower temperatures, depending on the nature of the second pillaring ion. AlFe-PILC showed higher thermal stability of the texture, the AlCu-PILC having lower values and lower thermal stability concerning both overall texture and micropore surface and volume. Poorer thermal stability of AlCu-PILC sample at higher temperatures was confirmed, the presence of Cu in the system contributing to complete destruction of aluminum silicate structure, by 'extracting' aluminum in stabile spinel form.