Please use this identifier to cite or link to this item: https://open.uns.ac.rs/handle/123456789/15249
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dc.contributor.authorMarić, Viktoren_US
dc.contributor.authorAleksić O.en_US
dc.contributor.authorŽivanov, Ljiljanaen_US
dc.date.accessioned2020-03-03T14:59:12Z-
dc.date.available2020-03-03T14:59:12Z-
dc.date.issued2006-12-01-
dc.identifier.isbn1424401178en_US
dc.identifier.urihttps://open.uns.ac.rs/handle/123456789/15249-
dc.description.abstractMethods for predicting and analyzing the behavior of NTC thermistors have remained the same and they typically include accurate measurements of resistance and temperature, followed by curve-fitting methodologies for determining the relationship of temperature to resistance for similar thermistor devices. In this paper, new approach based on using commercial software tools was applied on the thick film segmented thermistor models. Obtained simulation results were compared with experimental results and validity of the adopted approach verified. Realized segmented thermistors were made of a low temperature NTC thick film paste NTC 3K3 95/2 with nanometer particle powder printed on alumina. © 2006 IEEE.en
dc.relation.ispartof2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedingsen
dc.titleDesign and simulation of thick film thermistors using commercial simulation toolsen_US
dc.typeConference Paperen_US
dc.identifier.doi10.1109/ICMEL.2006.1650997-
dc.identifier.scopus2-s2.0-77956555944-
dc.identifier.urlhttps://api.elsevier.com/content/abstract/scopus_id/77956555944-
dc.description.versionUnknownen_US
dc.relation.lastpage482en
dc.relation.firstpage479en
item.fulltextNo Fulltext-
item.grantfulltextnone-
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