Please use this identifier to cite or link to this item:
https://open.uns.ac.rs/handle/123456789/15249
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Marić, Viktor | en_US |
dc.contributor.author | Aleksić O. | en_US |
dc.contributor.author | Živanov, Ljiljana | en_US |
dc.date.accessioned | 2020-03-03T14:59:12Z | - |
dc.date.available | 2020-03-03T14:59:12Z | - |
dc.date.issued | 2006-12-01 | - |
dc.identifier.isbn | 1424401178 | en_US |
dc.identifier.uri | https://open.uns.ac.rs/handle/123456789/15249 | - |
dc.description.abstract | Methods for predicting and analyzing the behavior of NTC thermistors have remained the same and they typically include accurate measurements of resistance and temperature, followed by curve-fitting methodologies for determining the relationship of temperature to resistance for similar thermistor devices. In this paper, new approach based on using commercial software tools was applied on the thick film segmented thermistor models. Obtained simulation results were compared with experimental results and validity of the adopted approach verified. Realized segmented thermistors were made of a low temperature NTC thick film paste NTC 3K3 95/2 with nanometer particle powder printed on alumina. © 2006 IEEE. | en |
dc.relation.ispartof | 2006 25th International Conference on Microelectronics, MIEL 2006 - Proceedings | en |
dc.title | Design and simulation of thick film thermistors using commercial simulation tools | en_US |
dc.type | Conference Paper | en_US |
dc.identifier.doi | 10.1109/ICMEL.2006.1650997 | - |
dc.identifier.scopus | 2-s2.0-77956555944 | - |
dc.identifier.url | https://api.elsevier.com/content/abstract/scopus_id/77956555944 | - |
dc.description.version | Unknown | en_US |
dc.relation.lastpage | 482 | en |
dc.relation.firstpage | 479 | en |
item.fulltext | No Fulltext | - |
item.grantfulltext | none | - |
Appears in Collections: | FTN Publikacije/Publications |
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