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dc.contributor.authorRadosavljević G.en
dc.contributor.authorMarić A.en
dc.contributor.authorStojanović, Goranen
dc.contributor.authorẐivanov L.en
dc.contributor.authorSmetana W.en
dc.contributor.authorUnger M.en
dc.contributor.authorHomolka H.en
dc.date.accessioned2020-03-03T14:58:22Z-
dc.date.available2020-03-03T14:58:22Z-
dc.date.issued2007-12-01en
dc.identifier.isbn1424408474en
dc.identifier.urihttps://open.uns.ac.rs/handle/123456789/15052-
dc.description.abstractThis paper introduces the LTCC as a novel technology for the fabrication of multilayer microelectronic components. Advantages of the multilayer structure will be presented on the example of the 3D inductor. © 2007 IEEE.en
dc.relation.ispartofProceedings of the International Semiconductor Conference, CASen
dc.titleThe fabrication process of RF inductor structures in the LTCC technologyen
dc.typeConference Paperen
dc.identifier.doi10.1109/SMICND.2007.4519693en
dc.identifier.scopus2-s2.0-48549085819en
dc.identifier.urlhttps://api.elsevier.com/content/abstract/scopus_id/48549085819en
dc.relation.lastpage252en
dc.relation.firstpage249en
dc.relation.volume1en
item.fulltextNo Fulltext-
item.grantfulltextnone-
crisitem.author.deptDepartman za energetiku, elektroniku i telekomunikacije-
crisitem.author.orcid0000-0003-2098-189X-
crisitem.author.parentorgFakultet tehničkih nauka-
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