Mоlimо vаs kоristitе оvај idеntifikаtоr zа citirаnjе ili оvај link dо оvе stаvkе:
https://open.uns.ac.rs/handle/123456789/15052
Pоljе DC-а | Vrеdnоst | Јеzik |
---|---|---|
dc.contributor.author | Radosavljević G. | en |
dc.contributor.author | Marić A. | en |
dc.contributor.author | Stojanović, Goran | en |
dc.contributor.author | Ẑivanov L. | en |
dc.contributor.author | Smetana W. | en |
dc.contributor.author | Unger M. | en |
dc.contributor.author | Homolka H. | en |
dc.date.accessioned | 2020-03-03T14:58:22Z | - |
dc.date.available | 2020-03-03T14:58:22Z | - |
dc.date.issued | 2007-12-01 | en |
dc.identifier.isbn | 1424408474 | en |
dc.identifier.uri | https://open.uns.ac.rs/handle/123456789/15052 | - |
dc.description.abstract | This paper introduces the LTCC as a novel technology for the fabrication of multilayer microelectronic components. Advantages of the multilayer structure will be presented on the example of the 3D inductor. © 2007 IEEE. | en |
dc.relation.ispartof | Proceedings of the International Semiconductor Conference, CAS | en |
dc.title | The fabrication process of RF inductor structures in the LTCC technology | en |
dc.type | Conference Paper | en |
dc.identifier.doi | 10.1109/SMICND.2007.4519693 | en |
dc.identifier.scopus | 2-s2.0-48549085819 | en |
dc.identifier.url | https://api.elsevier.com/content/abstract/scopus_id/48549085819 | en |
dc.relation.lastpage | 252 | en |
dc.relation.firstpage | 249 | en |
dc.relation.volume | 1 | en |
item.fulltext | No Fulltext | - |
item.grantfulltext | none | - |
crisitem.author.dept | Departman za energetiku, elektroniku i telekomunikacije | - |
crisitem.author.orcid | 0000-0003-2098-189X | - |
crisitem.author.parentorg | Fakultet tehničkih nauka | - |
Nаlаzi sе u kоlеkciјаmа: | FTN Publikacije/Publications |
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